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Design And Development Of An Optimised Thermoelectric Cooler For Active Processor Cooling.

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Figure 1.1: 35 Years of Microprocessor Trend Data (Sam Naffziger, AMD)
Figure 2.1: Thermoelectric module theory (Source: V-Infinity)
Figure 2.2: Basic Construction of a Single-Stage TEC (TEC Microsystem)
Figure 2.3: Schematic of CPU cooled by direct die TEC heat sink
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