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Advanced Electron Transparency Sample Preparation

Focused Ion Beam Techniques

Riza Iskandar

(2)

Aachen

Netherland

Belgium

(3)

Aachen

(4)

FIB

LC-SEM

Central Facility for Electron Micrsocope

(GFE)

(5)

Ernst Ruska-Centre for Microscopy and Spectroscopy with Electrons

(6)

FEI TITAN 80 – 300 (2006)

Cs-corrected protoype

Cs-corrected Cs/Cc-corr.

Rose, Haider, Urban

(1998)

(7)

Outline

• Electron Transparency sample preparations

• Focused Ion Beam Techniques

Principle

Techniques

Advantages and Disadvantages

• Applications

Ceramics

Steel

Life Science

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Electron Transparency Sample Preparations

[1]

Specimen‘s requirements:

Fit into TEM holder cup

(3 mm disc)

Electron transparent

(< 100 nm)

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(11)

Focused Ion Beam Chamber and Lamella

Gas injection needles

(12)

Focused Ion Beam Source

Basic Principle

• Use liquid metal ion sources (LIMS), eg. Ga • Liquid flow from reservoir

• Ion formation

• External beam interaction

Schematic diagram of Ga LMIS [2]

(13)

Quantitative comparison of FIB ions and SEM electrons

[3]

(14)

Secondary Electron (SEM) vs Secondary Ion Mode (FIB)

• Secondary electron

• Detector biased positive • Images generated from e-• Emitted from top 50 – 100 Å

• Only charging up a few volts to go dark • Grounded metals very bright, oxides dark • Secondary ion mode

• Detector biased negative • Images generated with I+ • Emitted from top 5-10 Å • Very surface sensitive • No voltage-contrast • Oxides brighter

• Less yield, so images noisier

SE Im

age

SI Im

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Depositing protection layer

• Platinum

• (methylcyclopentadienyl) trimethyl platinum -C5H4CH3Pt(CH3)3

• Solid at room temperature

• Operating temperature 38-42°C • About 10 minute warm-up period • User refillable (use fume hood)

• Very hard: tougher for probing and thermal cycling

• Chemically resistant

• Tungsten

• Tungsten hexacarbonyl - W(CO)6

• Lower resistivity than Pt (better for circuit edit) • Slower deposition than Pt

• Solid at room temperature • User refillable

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Focused

Ion Beam

Procedures

1 2 3 4

5 6 7 8

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What a FIB does (but a SEM does not)

[4]

• Removes material • Adds material

• Secondary ion imaging shows material contrast • Channelling contrasts

• Prepares sample in situ

• Combines high magnification imaging and sample modification

Interactions of the ion beam with sample surface. The unique control offered by beam currents and spot sizes allow use of the FIB for both nano engineering as well as for high resolution imaging using secondary electrons as well as ions [5].

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Advantages vs Disadvantages

• Advantages

Reduces preparation time

Prepare almost any kind of materials

Large homogenous sample thickness

Specific area can be selected

Can be combined with other analysis techniques

• Disadvantages

Sample thickness less than 50 nm forms amorphous layer

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OXIDATION RESISTANCE OF

MAX PHASE

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MAX Phase

[6,7]

• Exhibit both metals and ceramic properties

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(24)

EFTEM elemental maps

• Interlayer contains no oxygen

• Slightly C enrichment at precipitates area

(25)

LITHIUM DETECTION ON ZNO

NANO-PARTICLES WITH

SMALL LITHIUM- ADDITION

(26)

Lithium detection on ZnO nano-particles with small

Li-Addition

(27)

ZnO + 6at.% lithium

STEM-HAADF

• Conventional preparation • Lateral size app. 200 nm • Impossible to detect Li

• Imbedded into resin • Prepared with FIB

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MICROSTRUCTURAL ANALYSIS OF GERMANIUM

MODIFIED TIN-COPPER BRAZING FILLER METALS

FOR TRANSIENT LIQUID PHASE (TLP) BONDING

OF ALUMINUM

[9]

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Motivation

Achieving the best precision

components using processes,

which are based on melt

Suitable Brazed Materials

Brazed production Suitable base Suitable Joint

Process TLP

Sn78Cu22 and Sn75Cu20Ge5

Melt Spinning Proccess

Microstructure Analysis

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Transient Liquid Phase Bonding

The Microstructure and mechanical

properties of TLP bond approximately those of the substrate material

A bond can be formed at a temperature much lower than the melting point of the resulting joint.

Thin liquid interlayer helps to eliminate the high bonding or clamping force

AlSi7Mg0,3 Teut = 577 °C Process

Tjoint = 530 °C Tjoint = 30 min

Low melting interlayer Interlayer liquefies

Interlayer is consumed by parent metals and joint solidifies

Further heating causes joint homogenization

Stage 1 Stage 2

Stage 3 Stage 4

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Melt Spinning Process

Process parameter Value

Extrusion pressure 200 mbar Rotation frequency of

the copper wheel 30 Hz Crucible nozzle width 0,5 cm

Crucible gap width 0,4 mm

• To thick (> 500 µm) • In homogenous phase

distribution

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EBSD Analysis - SnCuGe Brazed Ribbon

SEM

Phase Distribution

Orientation Distribution

• The Sn phase has a preferred orientation in contrast to the CuSn phase. • Solidification of CuSn (h) phase in liquid matrix

• Solidification of Sn phase as a large crystals

• Different grain sizes indicates the solidification processes.

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SIGMA (s)-PHASE FORMATION MECHANISMS IN

HIGH CHROMIUM CONTENT IRON-CHROMIUM

MODEL ALLOYS WITH SMALL ADDITION OF

MOLYBDENUM FOR HIGH TEMPERATURE

APPLICATION

[10]

(36)

Sigma Phase

Difficulties to accurately determining phase boundary of

s

-phase due to

[11]

Slowness of formation

Dependence of purity of alloys

Dependence of mechanical states

Dependence of temperature annealing

• For oxidation resistance

s

-phase on grain boundary consumes chromium and causes loss of

oxidation resistance

[12]

(37)

Old and New Fe-Cr Phase Diagrams

Aim:

To understand the

s

-phase formation caused by addition molybdemum

based on the new phase diagram

Old New

Range of Cr-contents for high temperature steels

(38)

SEM BSE and TEM BF Images

B

B

A A

s-phase Internal Precipitate

s

IP

s

(39)

HRTEM image of

Filtered HRTEM image from selected area (left) and filtered FFT pattern (right)

[310]

[001]

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3D RECONSTRUCTION OF FIB

FOR BIOMATERIAL

APPLICATIONS

(42)

3D imaging of large biological samples by Dualbeam FIB

[13,14]

Limitation of conventional method, ultramicrotomy and cryogenic

ultramicrotomy:

• Inability to maintain true structural features

• Cellular structures are generally compressed in the direction of cutting

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Summary

• FIB systems are similar to SEMs in many ways • It uses ion instead of electron

• It can be used for SEM, TEM, STEM, AES, EDS sample preparation • It’s very suitable to prepare specific area of the sample

• It can be used to prepare Biological and material science samples • Limitless possibilities. Anything one can make, can be cut.

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References

1. David B. Williams and C. Barry Carter, Transmission Electron Microscopy, Springer 2009

2. Gailly P, Collette J-P, Renson L, Tock JP (1999) Ion Beam Figuring of Small BK7 and Zerodur Optics: Thermal Effects. Proceedings of the SPIE 3739:124–131.

3. Cambridge Universitz Press, 978-0-521-83199-4, Focused Ion Beam Systems: Basics and Applications, Edt:

Nan Yao

4. FEI, Focused Ion Beam Basics

5. John Melngailis, Focused ion beam technology and applications, Journal of Vacuum Science & Technology B, Nanotechnology and Microelectronics: Materials, Processing, Measurements, and Phenomena 5, 469, (1987)

6. M. W. Barsoum and T. El-Raghy, American Scientist, Volume 89, 2001

7. D.E. Hajas, et.al, Surface & Coatings Technology, 206 (2011) pp 591-598 8. R. Iskandar 2017 J. Phys.: Conf. Ser. 817012011

9. R. Iskandar et.al, Material Science and Engineering Technology, October 2017, Accepted

10. R. Iskandar et. al, International Microscopy Congress, Prague 2014

11. Stanislaw M. Dubiel and Jakub Cieslak, Sigma Phase in Fe-Cr nad Fe-V alloy systems and ist physical properties

12. N. Lopez, M. Cid, and M. Puiggali, Influence of s-phase on mechanical properties and corrosion resistance of duplex stainless steels, Corrosion Science, vol. 41, no. 8, pp. 1615-1631, 1999

13. K. Grandfield and H. Engqvist, Focusedion beam in the study of biomaterials and biological Matter, Advances in Materials Science and Engineering, Vl 20112, Atcle ID 841961

14. K. Narayan and S. Subramanam, Focused ion beams in biology, Nature methods, Vol. 12. No 11, Nov 2015,

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