S FIS 1006335 Bibliohraphy

(1)

Listya Utari, 2014

Penumbuhan Lapisan Film Tebal Ag, Pd/Ag, Dan Au Dengan Menggunakan Metode Screen Printing Yang Diaplikasikan Sebagai Mikrostrip Bandpass Filter

Universitas Pendidikan Indonesia | repository.upi.edu | perpustakaan.upi.edu DAFTAR PUSTAKA

Aftanasar, M.S. dkk. (2002). Rectangular Waveguide Filters Using Photoimageable Thick film Processing. Microwave Conference, 2002. 32nd European, hlm 1-4.

Alaydrus, Mudrik. (2010). Designing Microstrip Bandpass Filter at 3.2 GHz. International Journal on Electrical Engineering and Informatics – Vol.

2, No. 2, hlm 71 – 83.

Alaydrus, Mudrik. (2012). Simulasi Filter Lolos Bawah dengan Teknologi Mikrostrip menggunakan Software Sonnet. Jurnal Telekomunikasi dan Komputer, Vol.3, No. 1, hlm 49 – 64.

Ali, W.M. dkk. (2007). Influence of the Fabrication Process on the Performance of X-Band Filters. Proceedings of Asia-Pacific Microwave Conference

2007.

Al-Maiyaly, Busrh K.H. (2013). Study the Effect of Thickness on the Electrical Conductivity and Optical Constant of Co3O4 Thin Films. Ibn AlHaitham Jour.for Pure & Appl. Sci., Vol.26, No.1, hlm 159-166.

Bhattacharjee, Sayantika dkk. (2013). Design of Microstrip Parallel Coupled Band Pass Filter for Global Positioning System. Journal of Engineering,

Computers & Applied Sciences (JEC&AS), Vol. 2, No. 5, hlm 28-32.

Chen, Liu dkk. (2004). Characterization of Substrate Materials for System-in-a

Package Applications. Journal of Electronic Packaging. Vol. 126. hlm

195-201.

Effendi, Elli Herlia. (1996). Konduktor Film Tebal Pada Rangkaian Hybrid IC. Buletin IPT, Vol.1, No.5-6, hlm 39 - 43.

(2)

51

Listya Utari, 2014

Universitas Pendidikan Indonesia | repository.upi.edu | perpustakaan.upi.edu

Gupta, Tapan K. (2003). Handbook Of Thick And Thin Film Hybrid Microelectronics. New Jersey : John Wiley & Sons.

Hong, Jia-Sheng. (2005). Microstrip Filter Design. [Online]. Tersedia di: http://home.eps.hw.ac.uk/~ceejh3/presentations/Microstrip%20Filter%2 0Design-JH2005.pdf

Hong, Jia-Sheng dan M.J.Lancaster. (2001). Microstrip Filter for RF/Microwave

Application. New York : John Wiley & Sons.

Hsieh, Ming-Liang dkk. (2006). Microstrip Cross-coupled Trisection Bandpass Filters Fabricated on High Dielectric Constant Ceramic Substrates.

International Conference on Electronic Materials and Packaging,

hlm 1-4.

Hsu, C.H. dan H.A. Ho. (2009). Hybrid Microstrip Compact Bandpass Filter Using High Permittivity Substrate. Progress In Electromagnetics Research Letters, Vol. 12, hlm. 59-67.

Lee, H dkk. (2013). Ag(Ta0.5Nb0.5)O3 Thick Film Based Microwave Band Pass Filters. Integrated Ferroelectrics: An International Journal, Vol.141, hlm. 64–71.

Manurung, Roberth V, dkk. (2012). Desain dan Fabrikasi Elektroda Biosensor: Metode Teknologi Film Tebal. Jurnal Ilmiah Elite Elektro, Vol.3, No.1, hlm 65-70.

Maulana, Eka. (2014). Teknologi Film Tebal Mikroelektronika. [Online]. Tersedia di: http://maulana.lecture.ub.ac.id/files/2014/10/03-Teknologi-Film-Tebal-mikroelektronika.pdf

Nurhayati, Sri dkk. (2013). Pengaruh Suhu Sinter Terhadap Karakteristik Keramik

Calsia Stabilized Zirconia Dengan Penambahan Natrium Karbonat

Untuk Elektrolit Padat. Indonesian Journal of Materials Science,

Vol.14, No.2, hlm 99-102.

(3)

52

Listya Utari, 2014

Purnama, Agustian. (2014). Filter Frekuensi .[Online]. Tersedia di: http://comp-eng.binus.ac.id/files/2014/05/Filter-Frekuensi.pdf

Rane, Sunit dan Vijaya Puri. (2001). Influence of Alumina Overlay on the Performance of Thin and Thick Film Microstrip Band Pass Filter. The

International Journal of Microcircuits and Electronic Packaging, Vol.

24, No.3, hlm 263-272.

Rane, Sunit dan Vijaya Puri. (2002). Thin Film, Thick Film Microstrip Band Pass Flter: A Comparison and Eﬀect of Bulk Overlay. Microelectronics Reliability, Vol. 2, hlm 1953 – 1958.

Rane, Sunit dan Vijaya Puri. (1998). Performance Comparison of Seven Section Parallel Coupled Microstrip Filter Using Various Ag Thick Film Pastes.

Proceedings of the International Conference on Computers and Devices

for Communication, hlm 445-447.

Retnaningsih, Lilis dkk. (2002). Pengaruh Dimensi Komponen dan Komposisi Pasta Terhadap Proses Pembuatan Rangkaian Hibrid Film Tebal. Jurnal Elektronika dan Telekomunikasi, No.1, Vol.II, hlm 37 – 40.

Sakinah, Lisa. (2011). Perancangan Dan Pembuatan Prototipe Band Pass Filter Untuk Optimasi Transfer Daya Pada Sinyal Frekuensi Rendah; Studi

Kasus: Sinyal EEG. (Tesis). Fakultas Matematika dan Ilmu Pengetahuan

Alam, Insitut Teknologi Sepuluh November. Surabaya.

Shingh, Paramjeet dan A.K. Verma. (2011). Analysis of Multilayer Microstrip Line of Finite Conductor Thickness using Quasi-Static Spectral Domain Analysis (SDA) and Single Layer Reduction (SLR) Method. Annual IEEE India Conference (INDICON),hlm 1-4.

Somer, Jakub. (2013). Application of Thick Films in the Modern Electronics. (Tesis). Faculty of Electrical Engineering and Communication, Brno University of Technology. Brno.

Supriyanto, Toto. (2010). Perancangan Bandpass Filter Untuk CPE m-WiMAX

(4)

53

Listya Utari, 2014

Supriyanto, Toto dan Teguh F. (2011). Desain RF Low Noise Band Pass Filter untuk Aplikasi WiMax Menggunakan Kapasitansi Aktif. Jurnal Ilmiah Elite Elektro, Vol.2, No.1, hlm 61-66.

Syamsiana, I.N. (2011). Perancangan Dan Pembuatan High Pass Butterworth Filter Orde Dua Dengan Spesifikasi Super Treble. Jurnal Teknik Elektro Politeknik Negeri Malang,Vol.9, No.6, hlm 73 – 85.

Tarr, Martin. (2007). Thick Film Technology. [Online]. Tersedia di: http://www.ami.ac.uk/courses/topics/0255_tft/

Vincent, Tracey. (2009). Transmission Line Features and Their Influence On GHz Conductor Loss. (Disertasi). Manufacturing Engineering and Material

Science Program, Worcester Polytechnic Institute. New-England.