Part I Introduction
P- S Roll
9.3 Case Study
In this section, challenges in the packaging of microelectromechanical systems (MEMS) are explained [22].
Table 9.2 Packaging Consequences [6]
Packaging Consequences Trade-Offs
Increased package information Decreases order-filling times Decreases tracking of lost shipments Increased package protection Decreases damage in transport
Increases weight
Decreases cube utilization from larger dimensions Increases product value
Increased standardization Decreases MH
Decreases customer customization
MEMS are made of mechanical devices and mechanical components that can be as small as a few microns. They can be mechanical interconnects of microsystems, and they can also receive signals from one physical domain and send them to another, such as mechanical to electrical, electrical to mechanical, and electrical to chemical. These devices are broadly categorized as either sensors or actuators.
MEMS sensors are devices such as pressure sensors, accelerometers, and gyro- meters that perceive an aspect of their environment and produce a corresponding output signal. Actuators are devices that are given a specific input signal on which
Table 9.3 Current Packaging Parameters, Challenges, and Suggested Possible Solutions for MEMS
Packaging Parameters
Challenges Possible Solutions
Release etch and dry
Washing away parts during release
Freeze drying, coating, or processes that reduce surface tension
Must release parts individually
after dicing Use dimples
Develop a dicing Laser sawing Dicing and
cleaving
Eliminating contamination caused by cooling fluid and
particulates during wafer sawing
Release dice after dicing Cleave wafers
Laser sawing
Wafer level encapsulation Die handling Damages top die’s face contact
region
Fixtures that hold MEMS dice by sides rather than top face, such as collects that fit existing pick- and-place equipment
Stress Abating performance degradation and resonant frequency shifts
Low modulus
Low creep die attach material Curling of thin film layers Annealing
Misalignment of device features Die attach materials with CTE similar to that of silicon
Outgassing Corrosion Low outgassing epoxies
Outgassing of organic solvents from polymeric die attach materials
Low modulus solders New die attach materials Removal of outgassing vapor Testing Applying nonelectric stimuli
to devices
Electrical test structures to mimic nonelectrical functions Testing moving device features
before release
Inability to release parts before dicing
Modify (where possible) wafer- scale probers to do nonelectrical tests
Cost-effective, high-throughput, and parallel-packaged device- test systems
to act and a specific motion or action is produced. Other examples of MEMS actua- tors are microengines, microlocks, and discriminators.
MEMS packaging is quite different from conventional integrated circuit (IC) packaging. Whereas many MEMS devices must interface with the environment to perform their intended functions, the package must be able to facilitate access with the environment while protecting the enclosed devices. The package must also not interface with or impede the action of the MEMS device. The incomplete attach- ment material should be low stress and low outgassing while also minimizing stress relaxation over time, which can lead to scale-factor shifts in sensor devices. The fabrication process used in creating the devices must be compatible with each other and not damage the devices. Many devices are specific in application, requiring custom packages that are not commercially available. Devices may also need media compatible packages that can protect the devices from harsh environments in which the MEMS device may operate. Current packaging parameters, challenges, and sug- gested possible solutions for MEMS are shown in Table 9.3.
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10 Storage, Warehousing, and Inventory Management
Maryam Abbasi
Department of Industrial Engineering, Amirkabir University of Technology, Tehran, Iran