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Copyright by DH Lee Dept. of SCEE

Kukdong University

2018 Fall IC Fabrication & Processing

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Appendix to Copper Plating – Schematics of Ideal Bottom-up Fill of Copper Seed Layer Deposition (1)

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Appendix – Schematics of Ideal Bottom-up Fill of Copper Seed Layer Deposition (2)

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Appendix – Schematics of Ideal Bottom-up Fill of Copper Seed Layer Deposition (3)

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Appendix – Schematics of Ideal Bottom-up Fill of Copper Seed Layer Deposition (4)

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Appendix – Schematics of Ideal Bottom-up Fill of Copper Seed Layer Deposition (5)

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Appendix – Schematics of Ideal Bottom-up Fill of Copper Seed Layer Deposition (6)