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Chapter 6. Diffusionless Transformation

Young-Chang Joo

Nano Flexible Device Materials Laboratory

Seoul National University

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3.5 Interface Migraiton

 Growth can be categorized into diffusion-controlled growth and interface-controlled growth

3.5 Interface Migration

 Phase transformation occurs by nucleation growth process.

 β forms at a certain sites within α (parent) during nucleation (interface created) then the α/β interface “migrate” into the parent phase during growth.

Types of interfaces

1. Glissile: by ㅗ glide → results in the shearing of parent lattice into the product (β), motion (glide) insensitive to temperature (athermal)

2. Non glissile (most of cases): migration by random jump of individual atoms

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3.5 Interface Migration

A. Heterogeneous Transformation

 Classifying nucleation and growth transformation (=heterogeneous transformation)

 Transformation by the migration of a glissile interface

→ Military transformation

 Uncoordinated transfer of atoms across non-glissile interface

→ Civilian transformation

Military transformation

 The nearest neighbors of any atom are unchanged.

 The parent product phases – the same composition, no diffusion involved (martensite transformation , mechanical twins)

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Classification of Nucleation & Growth

Transformation

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Model of Edge Dislocation

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Geometry of edge dislocation

 Slip plane: where slip occurs

 Dislocation line: boundary between the slipped and unslipped part of a crystal

 Slip plane contains both Burgers vectors and dislocation lines

 Edge dislocation: Burgers vector b ⊥ dislocation line

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Metallic crystal system

 Close Packing Crystal structure

closed packed atomic arrangement in 2-D

 How can we stack metal atoms to minimize empty space?

Now stack these 2-D layers to make 3-D structures

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Metallic crystal system

 Stacking sequence

A A A A A

A A A A A

A A A A A

A A A A A

A A A A A

B B B B

B B B B

B B B B

B B B B

C C C C

C C C C

C C C C

C C C C

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Metallic crystal system

 A – B – A – B stacking sequence  HCP

A A A A A

A A A A A

A A A A A

A A A A A

A A A A A

B B B B

B B B B

B B B B

B B B B

C C C C

C C C C

C C C C

C C C C

B B B B

B B B B

B B B B

B B B B

A A A A A

A A A A A

A A A A A

A A A A A

A A A A A A

B

A

A

B

B

A

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Dislocation in FCC Crystal

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Partial Dislocation (FCC)

Difficult

Easy

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Extended Dislocation (FCC)

Stacking Fault

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ABABAB - hcp ABCABC - ccp

Stacking fault ABCBABC ABCBCABC

Stacking Fault

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Twin

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Twin

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Martensite

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Continuous Cooling Transformation

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Continuous Cooling Transformation

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Martensite Transformation in Steel

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Martensite Transformation in Steel

Ferrite

𝑪 = 𝟎. 𝟐𝟖𝟔𝟔 + 𝟎. 𝟎𝟏𝟔𝟔𝒙 𝒂 = 𝟎. 𝟐𝟖𝟔𝟔 + 𝟎. 𝟎𝟎𝟏𝟑𝒙

Austenite

𝒂𝟎 = 𝟎. 𝟑𝟓𝟓𝟓 + 𝟎. 𝟎𝟎𝟒𝟒𝒙

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Martensite

Lath Martensite Twinned Martensite

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Shape memory alloy

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Shape memory alloy

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Needs of shape memory alloy thin film

 Micro-electro-mechanical system

 Micro scale & great surface / volume ratio

 Large deformation

 Large recovery force

 Fast response rate

 micropumps, micro-sensors, microgrippers etc.

Micromirror Microelectrode clipping

(Y.Fu et al., Sensors and Actuators , 2004)

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Martensitic transformation

 Phase transformation that occurs by cooperative atomic

movements – military transformation

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Shape memory effect

 Thermoelastic martensitic transformation

 Plastic strain that introduced into a material by twinning deformation in martensite recovers completely when the alloy is heated above a certain temperature.

 Plastic flow occurs by twinning rather than slip

Austenite Martensite

Deformation

Austenite

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Superelasticity and Shape memory

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Superelasticity and Shape memery

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Habit Plane

 The interface plane between austenite and

martensite as measured on a macroscopic scale.

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Detecting of Transformation

DSC Stress Electrical Resistivity

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