JFET
• Biasing FET complicated ac signal
superimposed on dc value - VGS
dc value - VGS
• VGS varies from sample to sample and with temperature.
•- VGS need another negative battery VGG,
• RS placed between S and ground S at potential ID RS
• Better biasing Fig. (12-6C) where R1 R2 voltage divider placed G desired potential with respect to ground
.
DD GG G
G DD
GG V
V R
R R R
R R
R
R R R
V R R
V R =
= + + ∴
+ =
=
2 1
1 2
2 1
2 1 2
1
1 , ,
G G
GG DD
G R R
R R R
and V
R V R
= −
=
2 1 2
2
The voltage around the gate "loop"
∑
V = 0 = V GG − I G R G − V GS − I D R S , neglect I RThevenin equivalents
∑
V = 0 = V GG − I G R G − V GS − I D R S ,GS GG
S
D
R V V
I = −
neglect IGRG
D
GS GG
s I
V
R V −
=
• Q point (ID, VGS ) VGG RG R1 R2
• Stable VGG must be large compared (VGS) the effect of any shift in VGS reduced.
See Table 12 -1
Example 1
Enhancement MOSFET
•
Normal operation requires
V
GSproper polarity
attract holes or electrons for
conduction in the channel conduction in the channel
•
In the transfer
characteristic the out put and the input need
V
GSbe positive
divider bias -
Voltage
• VDD divided by R1 and R2
• VGG proper magnitude and polarity VGS = VGG - VS = VGG – ID Rs
feedback bias -
Drain - feedback bias Drain
• ∆∆∆∆ ID due to changing device or circuit parameters fed back to the gate
• IG negligible RG very high VGS = VDS
• VGS > VT Operation in the normal region see ex (1) in Ch (6)
• if iD increase for any reason VDS and VGS decrease
BJT Biasing
Normal operation of BJT
E - B junction is forward C - B junction is reveres
Common - emitter configuration
• voltage have the same polarity can be supplied by the single battery
Complicated biasing problem
Variation in parameters among a mass-producted transistor Sensitivity of semiconductor to temperature
Fixed - Current Bias
•
I
B= (V
CC/R
B)
Q
known if the collector characteristics known
precisely
but it doesn't .
αα
αα αααα α α α α ββββ
• iC = (αααα /1 - αα)iαα B + (ICBO/1 - α α α α ) = ββββ iB + (ICBO/1 - ααα)α
• i
Cvary widely with large variations in β β β β and I
CBOexpected
among mass -
produced transistor
b), 9 . 12 In Fig (
• I
B= 0.3 β β = 50 β β
placed Q in the linear region of the output characteristic of transistor
• β β β β = 120
I = 0.3
I
vary
• β β β β = 120
I
B= 0.3
I
Cvary widly with temperature
• β β β β increases
linearly with temperature
• I
CBOincreases
exponentially
with temperature
Thermal Runaway
•
At the collector junction the power loss because VDS high compared to low VBE forward -biased emitter junction .(1 )
C B C B O
i = β i + + I
• IC increases power developed increased the junction temperature increases ICBO ββββ IC increasing and so on.
• Regenerative heating cycle occur thermal runaway transistor Destruction
Overcome Thermal runaway
• Cool the transistor
• Used an effective biasing circuit.