LIGA super jadwal pertandingan process

LI – lithography

Materials tailored to the individual function in application - Cu, Au → electrical conductors

- Ni, Fe → softmagnetic materials

- Polymers, ceramic materials → insulators

Flexible geometry (no restriction to specific crystallographic planes) High lateral precision (small shrinkage) _≅ 0.5 µm

Smooth structure at the side walls (roughness < 50 nm, optical quality) Very high aspect ratio 1 : 100

Moulding possible directly on the Si wafer Independent of the substrate

Independent of the substrate

Useful for low-cost mass production

Reduction of fabrication costs by a simultaneous implementation of many elements

Disadvantage:

for fabrication of complex components → micro mounting necessary; no possibility to implement electronic circuits;