3.4 Effect of Hygrothermal Excitation on One-Dimensional Smart
3.4.1 Solution Procedure
The solution procedure for hollow and solid MEE cylinders is given in this section similar to those reported in [40] for magnetoelectroelastic cylinders. Substituting Eqs. (3.103) and (3.25) into Eq. (3.24) results in the following coupled ordinary differential equations in terms of moisture concentration, temperature change, magnetic potential, electrical potential, and displacement:
c33r2u;rrþc33ru;rc11uþe33r2u;rrþðe33e31Þru;r
þd33r2/;rrþðd33d31Þr/;rb1r2#;r
ðb1b3Þr#n1r2m;rðn1n3Þrmþqdr3x2¼0 ð3:104aÞ e33r2u;rrþðe31þe33Þru;r 233r2u;rr 233r/;r
g33r2u;rrg33ru;rþc1r2#;rþc1r#þv1r2m;rþv1rm¼0 ð3:104bÞ d33r2u;rrþðd31þd33Þru;rg33r2/;rrg33r/;rl33r2u;rr
l33ru;rþs1r2#;rþs1r#þt1r2m;rþt1rm¼0 ð3:104cÞ The non-dimensional parameters are introduced in Eq. (3.28) and new electric potential, magnetic potential, temperature change, and moisture concentration change as:
U¼e33
c33/; W¼d33
c33u; H¼ b1
c33#; M¼ n1
c33
m ð3:105Þ Using Eqs. (3.28) and (3.105), Eq. (3.104) can be rewritten in the following form:
r2u;rrþru;rauþr2U;rrþð1bÞrU;rþr2W;rrþð1mÞrW;r
r2H;rð1gÞrHr2M;rð11ÞrMþXr3
a2¼0 ð3:106aÞ r2u;rrþð1þmÞru;rfr2U;rrfrU;rkr2W;rrkrW;r
þYr2H;rþYrHþWr2M;rþWrM¼0 ð3:106bÞ r2u;rrþð1þbÞru;rcr2U;rrcrU;rfr2W;rrfrW;r
þXr2H;rþXrHþVr2M;rþVrM¼0 ð3:106cÞ in which,
X¼qdx2a2 c33
ð3:107Þ
The following set of second-order coupled ordinary differential equations with constant coefficients is obtained by using the non-dimensional radial coordinate q¼raand then changing variableq withsbyq¼es as follows:
€
uauþU€ bU_ þW€ mW_ ¼aesH_ þð1gÞaesH
þaesM_ þð11ÞaesMXae3s ð3:108aÞ
€
uþbu_cU€fW€ ¼ XaesH_ XaesHVaesM_ VaesM ð3:108bÞ
€
uþm_ufU€kW€ ¼ YaesH_ YaesHWaesM_ WaesM ð3:108cÞ in which, the overdot stands for differentiation with respect to s. For uncoupled hygrothermomagnetoelectroelastic problems, temperature and moisture concentra- tion distributions are obtained separately by solving heat conduction and moisture diffusion equations. The axisymmetric and steady state Fourier heat conduction and Fickian moisture diffusion equations for an infinitely long hollow cylinder are written as [17]:
1
rrkTh;r
;r¼0 ðHeat conduction equationÞ ð3:109aÞ 1
rrkCm;r
;r¼0 ðMoisture diffusion equationÞ ð3:109bÞ where, kT and kC are thermal conductivity and moisture diffusivity coefficients, respectively. Solving Eq. (3.109) and using the non-dimensional radial coordinate as well as the new parameters defined in Eq. (3.105) result in the following tem- perature and moisture concentration distribution along the radial direction for a homogenous cylinder:
102 3 Multiphysics of Smart Materials and Structures
H¼C1lnð Þ þq C2 ð3:110aÞ M¼C3lnð Þ þq C4 ð3:110bÞ whereC1,C2,C3, andC4 are integration constants which are determined by satis- fying the hygrothermal boundary conditions. The non-dimensional temperature change on the inner and outer surfaces of the hollow cylinder are, respectively, assumed to be Ha and Hb. Similarly, non-dimensional moisture concentration change are assigned to beMaandMbon the inner and outer surfaces. The integration constants according to the hygrothermal boundary conditions can be obtained as:
C1¼HbHa
lnð Þi ; C2¼Ha; C3 ¼MbMa
lnð Þi ; C4¼Ma ð3:111Þ in which,i¼bais the aspect ratio of the hollow cylinder. It should be mentioned that for solid cylinders as well as hollow cylinders with uniform temperature and moisture concentration rise, we haveC1 ¼C3¼0. For more general hygrothermal boundary conditions, one may refer to the Robin-type boundary conditions con- sidered in [17,32]. It is worth noting that temperature and moisture concentration have similar effects on magnetoelectroelastic responses in uncoupled hygrother- momagnetoelectroelasticity according to Eqs. (3.108) through (3.111). The solution of Eq. (3.108) can be found analytically by successive decoupling method [40].
Eliminating Ubetween equations in (3.108) leads to the following two ordinary differential equations aboutu andW:
1þc
ð Þuvb2þac _
uþðcfÞWvþðbfmcÞW€
¼ðcXÞaesH€þðcð2gÞ þXðb2ÞÞaesH_ þðcð1gÞ þXðb1ÞÞaesH þðcVÞaesM€ þðcð21Þ þVðb2ÞÞaesM_
þðcð11Þ þVðb1ÞÞaesM3aXce3s
ð3:112aÞ cf
ð Þ€uþðmcbfÞu_þf2kcW€ ¼ðXfYcÞaesH_
þðXfYcÞaesHðVfWcÞaesM_ þðVfWcÞaesM ð3:112bÞ By eliminatingWbetween Eqs. (3.112) and considering the temperature change and moisture concentration change distributions according to Eq. (3.110), the fol- lowing ordinary differential equation with constant coefficients for radial dis- placementuis achieved:
a2uvþa1u_ ¼ðb1C2þb2C1þb4C4þb5C3Þesþðb1C1þb4c3Þsesþb5e3s ð3:113Þ
where,
a1¼ðmcbfÞ2
f2kc b2þac
; a2¼1þcðcfÞ2 f2kc b1¼a cð1gÞ þXðb1Þ ðXfYcÞðbfmcþcfÞ
f2kc
b2¼a cð2gÞ þXðb2Þ ðXfYcÞðbfmcþ2c2fÞ f2kc
b3¼a cð11Þ þVðb1Þ ðVfWcÞðbfmcþcfÞ f2kc
b4¼a cð21Þ þVðb2Þ ðVfWcÞðbfmcþ2c2fÞ f2kc
b5¼ 3acX
ð3:114Þ
The solution of Eq. (3.113) in terms of variableqcan be expressed as:
u¼AþCqmþDqmþðK1lnð Þ þq K2ÞqþK3q3 ð3:115Þ in which,
m¼i ffiffiffiffiffi a1
a2
r
m2R and i¼ ffiffiffiffiffiffiffi 1
p
ð3:116Þ
andA,C, andDare integration constants. Employing Eqs. (3.113) and (3.115), the following expression forWcan be obtained:
W¼FþElnð Þ þq Cc1qmþDc2qmþðc3lnð Þ þq c4ÞqþK3c5q3 ð3:117Þ where,Eand Fare new integration constants and:
c1¼ 1
mkcf2ðmðcfÞ þmcbfÞ;c2 ¼ 1
mkcf2ðmðcfÞ mcþbfÞ c3¼ 1
kcf2ðK1ðcð1þmÞ fð1þbÞÞ aC1ðXfYcÞ aC3ðVfWcÞÞ c4¼ 1
kcf2ðK2ðcfÞ þðK2K1ÞðmcbfÞ þa Cð 1C2ÞðXfYcÞ þa Cð 3C4ÞðVfWcÞÞ
c5¼ 1
3kcf2ð3ðcfÞ þmcbfÞ
ð3:118Þ
104 3 Multiphysics of Smart Materials and Structures
Using Eq. (3.108b) and considering Eqs. (3.115) and (3.117), U can be expressed by:
U¼HþGlnð Þ þq Cl1qmþDl2qmþðl3lnð Þ þq l4ÞqþK3l5q3 ð3:119Þ in which,Gand Hare integration constants and:
l1 ¼ 1
mcðmþbmfc1Þ;l2¼ 1
mcðmbmfc2Þ l3 ¼1
cðK1ð1þbÞ fc3þaXC1þaVC3Þ l4 ¼1
cðK2þðK2K1Þbc4fþaX Cð 2C1Þ þaV Cð 4C3ÞÞ l5 ¼ 1
3cð3þb3fc5Þ
ð3:120Þ
For convenience, the following non-dimensional stresses, displacement, electric potential, and magnetic potential are used:
Rrr¼rrr
c33;Rhh¼rhh
c33;Rzz¼rzz
c33;U¼u
a;U1 ¼U
a;W1¼W
a ð3:121Þ Then, we reach:
Rrr¼q1
a ðdAþGþEÞ þqm1
a ðmð1þl1þc1Þ þdÞC þqm1
a ðmð1þl2þc2Þ þdÞDþlnð Þq
a ðK1ð1þdÞ þl3þc3a Cð 1þC3ÞÞ þ1
aðK1þð1þdÞK2þl3þl4þc3þc4a Cð 2þC4ÞÞ þq2
a ð3 1ð þl5þc5Þ þdÞK3
ð3:122aÞ Rhh¼q1
a ðdAþbGþmEÞ þ qm1
a ðmðdþbl1þmc1Þ þdÞC þqm1
a ðmðdþbl2þmc2Þ þdÞDþlnð Þq
a ðK1ðdþaÞ þbl3þmc3aðgC1þ1C3ÞÞ þ 1
aðdK1þðdþaÞK2þbðl3þl4Þ þmðc3þc4Þ aðgC21C4ÞÞ þ q2
a ð3ðdþbl5þmc5Þ þaÞK3
ð3:122bÞ
Rzz¼q1
a ðdAþbGþmEÞ þqm1
a ðmðdþbl1þmc1Þ þdÞC þqm1
a ðmðdþbl2þmc2Þ þdÞDþlnð Þq
a ðK1ðdþdÞ þbl3þmc3aðgC1þ1C3ÞÞ þ1
aðdK1þðdþdÞK2þbðl3þl4Þ þmðc3þc4Þ aðgC2þ1C4ÞÞ þq2
að3ðdþbl5þmc5Þ þdÞK3
ð3:122cÞ W1¼F
a þE
alnð Þ þq C
ac1qmþD
aC2qmþðc3lnð Þ þq c4Þq a þK3c5
a q3 ð3:122dÞ U1¼H
a þG
alnð Þ þq C
al1qmþD
al2qmþðl3lnð Þ þq l4Þq a þK3l5
a q3 ð3:122eÞ U¼A
a þC aqmþD
aqmþ K1
a lnð Þ þq K2 a
qþK3
a q3 ð3:122fÞ We have seven integration constants in the aforementioned equations; however, there exist only six boundary conditions in the magnetoelectroelastic medium.
Therefore, one complimentary equation is needed which is obtained by substituting Eqs. (3.115), (3.117), and (3.119) into Eq. (3.108):
aAþmEþbG¼0 ð3:123Þ The integration constants are obtained in the following subsections for hollow and solid cylinders. Although the solution procedure for this hygrothermomagne- toelectroelastic analysis under steady-state condition is the same as [40], the work is a pioneer in such emerging multiphysical analysis. The analytical solutions given in Eq. (3.122) could be employed for the design of MEE structures as well as a benchmark solution for verification of the other analytical and numerical results which will be used later for the multiphysical problem.
To consider the effect of temperature and moisture dependency of elastic coef- ficients on the magnetoelectroelastic response, the elastic coefficients are expressed in the following form [41,42]:
Cij¼Cij0ð1þa#þbMÞ ð3:124Þ in which,Cij0 is an elastic coefficient at stress-free temperature and moisture con- centration;aandbare empirical material constants for temperature and moisture dependency. In the current work, the temperature and moisture dependency is only considered for uniform temperature and moisture concentration rise to avoid dealing with non-linear–problems [43].
106 3 Multiphysics of Smart Materials and Structures