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Integration of the stimulation tens and hot compress devices therapy to relieve pain (Conference Paper)
, , , ,
Departement of Mechanical Engineering, Diponegoro University, Jl.Prof. Soedarto, SH Tembalang Semarang, 50275, Indonesia
Departement of Mechanical Engineering, 17 Agustus 1945 University, Jl. Perjuangan 17, Cirebon, 45135, Indonesia
Abstract
Various ages especially the elderly persons can suffer neuropathic pain . It causes discomfort able effects for the patient. It is necessary to treat it well, so it does not depend on medication treatment anymore. One of the methods for pain relief is a therapy which is using TENS , a device that can help relieve pain . Any cases explain that the pain is still experienced by the patient even have been treated using TENS . Then further research has developed, a hot compress method that gives rise to a sense of comfort for therapy patients. © 2019 Elsevier Ltd. All rights reserved.
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Electrical Heat compress Pain therapy TENS Therapeutic
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Materials Today: Proceedings Volume 13, 2019, Pages 169-174
6th International Conference on Advanced Materials Science and Technology, ICAMST 2018;
Semarang; Indonesia; 9 October 2018 through 10 October 2018; Code 155285
Karmani, J.a,b Munadi, M.a Setiawan, J.D.a Widyanto, S.A.a Paryanto, P.a
a
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Transcutaneous Electric Nerve Stimulation | Pain | Electrical nerve
ISSN: 22147853
Source Type: Conference Proceeding Original language: English
DOI: 10.1016/j.matpr.2019.03.209 Document Type: Conference Paper
Volume Editors: binAhmad A.L.,Khairurrijal K.,Triyana K.,Nur H.,Wasisto H.S.,Diantoro M.
Publisher: Elsevier Ltd
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Preferences for heat, cold, or contrast in patients with knee osteoarthritis affect treatment response.
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Transcutaneous electrical nerve stimulation (TENS) a possible aid for pain relief in developing countries?
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Karmani, J.; Departement of Mechanical Engineering, Diponegoro University, Jl.Prof. Soedarto, SH Tembalang Semarang, Indonesia; email:
© Copyright 2019 Elsevier B.V., All rights reserved.
joni_075@yahoo.com
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9/1/2019 ICAMST 2018 - The International Conference on Advanced Materials Science and Technology 2018
kosatem.org/icamst2018/ 1/3
ICAMST 2018
(http://kosatem.org/icamst2018/)
The International Conference on Advanced Materials Science and Technology 2018
icamst2018@kosatem.org (mailto:icamst2018@kosatem.org) +6282135243883 (tel:+6282135243883)
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ICAMST 2018
The International Conference on Advanced Materials Science and Technology 2018.
Selected paper will be published: 1. Reputable International Journal (Buletin of Chemical Reaction Engineering and Catalysis); 2. Technology Journal; 3. Proceeding indexed by
Scopus
Novotel, Semarang 9-10 October 2018
6th International Conference on Advanced Materials Science and Technology 2018
Semarang, 9-10th October 2018
1 CONFERENCE PROGRAM
Time Program
Tuesday, 9th October 2018
07.30 – 08.30 Registration + Coffee Break Opening Ceremony
08.30-08.35 - Welcome address of Chairman of Organizing Committee
08.35-08.40 -Welcome address of Chairman of Kosatem 08.40-08.50
- Welcome address of Rector of Diponegoro University
- Opening 08.50-09.00 Photo Session Plenary Session I
09.00-10.30
Keynote Speaker I Michikazu Hara
Tokyo Institute of Technology, Japan Keynote Speaker II
Sutikno Madnasri, Universitas Negeri Semarang, Indonesia
Plenary Session II 10.30-11.30
Keynote Speaker III Abdul Latif
Universiti of Sains Malaysia 11.30-12.30 Lunch break
Oral Presentation
12.30-15.00 Oral presentation session 1 15.00-15.15 Coffee break
15.15-17.15 Oral presentation session 2 17.15-17.30 Closing
Wednesday, 10th October 2018
09.00-12.00 Discussion forum and City Tour
9/1/2019 Organizing Committee - ICAMST 2018
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(http://kosatem.org/icamst2018/)
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9/1/2019 Organizing Committee - ICAMST 2018
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Scienti c Commitee : Kuwat Triyana, UGM, Indonesia
Michikazu Hara, Tokyo Institute of Technology Abdul Latif Ahmad, Universiti Sains Malaysia
*)Seiichi Miyazaki, Nagoya University, Japan Ariando, NUS, Singapore
*)Mohamad Deraman, UKM, Malaysia Risa Suryana, UNS, Indonesia Mikrajuddin Abdullah, ITB, Indonesia
Amun Amri, UNRI, Indonesia Darminto, ITS, Indonesia
*)Didier Fasquelle, ULCO, France Hadi Nur, UTM, Malaysia
Chairman : Heru Susanto, Undip, Indonesia
Co-Chairmen : Khairurrijal, ITB, Indonesia Eko Hadi Sujiono, UNM, Indonesia
Sutikno, UNNES, Indonesia Markus Diantoro, UM, Indonesia
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5/2/2020 Integration of the Stimulation TENS and Hot Compress Devices Therapy to Relieve Pain - ScienceDirect
https://www.sciencedirect.com/science/article/pii/S2214785319305681 1/2
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Materials Today: Proceedings
Volume 13, Part 1, 2019, Pages 169-174
Integration of the Stimulation TENS and Hot Compress Devices Therapy to Relieve Pain
JoniKarmani , MunadiMunadi , Joga DharmaSetiawan , Susilo AdiWidyanto , ParyantoParyanto
Departement of Mechanical Engineering, Diponegoro University, Jl.Prof. Soedarto, SH Tembalang Semarang.50275, Indonesia
Departement of Mechanical Engineering, 17 Agustus 1945 University, Jl. Perjuangan 17, Cirebon, 45135, Indonesia
Available online 31 May 2019.
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https://doi.org/10.1016/j.matpr.2019.03.209
Abstract
Various ages especially the elderly persons can suffer neuropathic pain. It causes discomfort able effects for the patient. It is necessary to treat it well, so it does not depend on medication
treatment anymore. One of the methods for pain relief is a therapy which is using TENS, a device that can help relieve pain. Any cases explain that the pain is still experienced by the patient even have been treated using TENS. Then further research has developed, a hot compress method that gives rise to a sense of comfort for therapy patients.
Keywords
pain therapy
;TENS
;heat compress
;electrical
;therapeutic
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5/2/2020 Fabrication of Porous Silicon using Photolithography and Reactive Ion Etching (RIE) - ScienceDirect
https://www.sciencedirect.com/science/article/pii/S221478531930553X 1/2
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Materials Today: Proceedings
Volume 13, Part 1, 2019, Pages 92-96
Fabrication of Porous Silicon using Photolithography and Reactive Ion Etching (RIE)
Nuraini DianPratiwi , MitaHandayani , RisaSuryana , OsamuNakatsuka
Department of Physics, Faculty of Mathematics andNatural Sciences, Sebelas Maret University,Jl. Ir. Sutami 36A Surakarta 57126 Indonesia
Department of Materials Physics, Graduate School of Engineering, Nagoya University, Furo-cho, Chikusa-ku, Nagoya 464-8603, Japan
Available online 31 May 2019.
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https://doi.org/10.1016/j.matpr.2019.03.194
Abstract
Phenomena of electrical and optical properties in porous silicon (PSi) remain interested. In this study, we focus on fabrication of PSi on N-type Si(100) surface using photolithography and
reactive ion etching (RIE) methods with variations of etching times for10, 20, 30, and 40 min. SEM analysis demonstrated similar Psi in shape and size. Based on the profilometer and the four- point probe (FPP) measurement, the pore depth and the resistivity of Psi increase with the increasing etching time. The pores can be consideredas a defect on the silicon surface which inhibits electron diffusion so that the resistivity will increase.
Keywords
porous
;silicon
;photolithography
;etching
;resistivity
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5/2/2020 Characterization of Latent 3D Laser Photoexposure Patterns in Photoresist Created by Direct Laser Writing - ScienceDirect
https://www.sciencedirect.com/science/article/pii/S2214785319305644 1/2
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Materials Today: Proceedings
Volume 13, Part 1, 2019, Pages 149-153
Characterization of Latent 3D Laser Photoexposure Patterns in Photoresist Created by Direct Laser Writing
EdyYulianto , SubhashriChatterjee, VygantasMizeikis
Research Institute of Electronics, Shizuoka University, 3-5-1 Johoku Hamamatsu 432-8011, Japan Available online 31 May 2019.
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https://doi.org/10.1016/j.matpr.2019.03.205
Abstract
We describe photoluminescence quenching method for use in characterizing 3D laser
photoexposure patterns in photoresist recorded during direct laser writing prior to development.
By scanning a focused laser beam through the exposed patterns in the photoresist, important features of the photoexposure patterns, such as their size and shape, and the exposure threshold can be determined.
Keywords
direct laser writing (DLW)
;photoluminescence (PL)
;photoexposure
;quenching
;threshold
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5/2/2020 Stress Analysis of the Friction Contact on filled Styrene Butadiene Rubber by a Blade Indentation: A Numerical Investigation - ScienceDirect
https://www.sciencedirect.com/science/article/pii/S2214785319305899 1/2
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Materials Today: Proceedings
Volume 13, Part 1, 2019, Pages 293-298
Stress Analysis of the Friction Contact on filled Styrene Butadiene Rubber by a Blade Indentation: A Numerical Investigation
BudiSetiyana , JamariJamari , Sugiyanto , DirkJan Schipper
Laboratory for Engineering Design and Tribology, Department of Mechanical Engineering, University of Diponegoro, Jl. Prof. Soedharto, Tembalang, Semarang 59275, Indonesia
Laboratory for Surface Technology and Tribology, Faculty of Engineering Technology, University of Twente, Drienerloolaan 5, Postbus 217, 7500 AE Enschede, Dutch The Netherlands
Available online 31 May 2019.
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https://doi.org/10.1016/j.matpr.2019.03.230
Abstract
The occurrence of rubber abrasion is started with a crack that occurs when maximum stress exceeds the breaking stress. Investigation of the rubber friction using a blade indenter is presented numerically in this paper. The rubber analyzed was Filled Styrene Butadiene Rubber that is commonly used for tires. The analysis was performed to obtain the stress pattern and maximum stress location of the deformed rubber. Simulation results showed that the magnitude and location of the maximum stress were strongly influenced by the depth of indentation and contact surface roughness.
Keywords
abrasion
;blade indenter
;friction
;rubber
;stress
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