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JFETs, GaAs DEVICES AND CIRCUITS, AND TTL CIRCUITS

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The length of the channel L is determined by the length of the gate electrode, and similarly by the width W (in the direction perpendicular to the face). Basically, a depletion region is formed in the channel below the gate surface and the thickness of the depletion region is controlled by the gate voltage vGS.

FIGURE 5.70   Physical operation of the  n -channel JFET:  (a)  For small  v DS the channel is uniform and the device functions as a resistance whose value is controlled by  v GS
FIGURE 5.70 Physical operation of the n -channel JFET: (a) For small v DS the channel is uniform and the device functions as a resistance whose value is controlled by v GS

GaAs AMPLIFIERS 3

Current Sources

EXERCISE

Provided vDS is maintained greater than |Vt|, the MESFET will operate in saturation and the current iD will be. 6.126) Thus the current source will have the equivalent circuit shown in fig. Before considering means of increasing the effective output resistance of the current source, we show in Fig.

A Cascode Current Source

6.39(c) how the basic current source can be connected to source currents to a load whose voltage can be as high as VDD − |Vt|. Alternatively, the same unit can be connected as shown in fig. 6.129) Adding the cascode transistor Q2 thus raises the output resistance of the current source by the factor gm2ro2, which is the inherent voltage gain of Q2.

Increasing the Output Resistance by Bootstrapping

6.129) Thus, the addition of the cascode transistor Q2 increases the output resistance of the current source by a factor of gm2ro2, which is the intrinsic voltage gain of Q2. The end result is that the trigger circuit causes a DC voltage of 1.4 V to appear on transistor Q1 of the current source.

FIGURE 6.41  Bootstrapping of a MESFET current source Q 1 : (a) basic arrangement; (b) an implementa- implementa-tion; (c) small-signal equivalent circuit model of the circuit in (b), for the purpose of determining the output resistance R o .
FIGURE 6.41 Bootstrapping of a MESFET current source Q 1 : (a) basic arrangement; (b) an implementa- implementa-tion; (c) small-signal equivalent circuit model of the circuit in (b), for the purpose of determining the output resistance R o .

A Simple Cascode Configuration–The Composite Transistor

To determine the output resistance of the boot current source, apply an incremental voltage va to node A, as shown in Fig. Thus, while gm of the composite device is equal to that of Q1, the output resistance is increased by the intrinsic gain of Q2, gm2ro2, which is typically in the range 10 to 40. This is a significant increase and is the reason for the attractiveness of the composite MESFET.

The composite MESFET can be used in any of the applications that can benefit from its increased output resistance. Another view of the operation of this circuit can be obtained by considering Q2 as a source follower, causing Q1's drain to follow the voltage changes at the current source terminal (node ​​A), thereby turning on Q1 and increasing the effective output resistance. the current source.

FIGURE 6.42  (a) The composite MESFET and (b) its small-signal model.
FIGURE 6.42 (a) The composite MESFET and (b) its small-signal model.

Differential Amplifiers

An introduction to this technology and its two basic devices, the MESFET and the Schottky barrier diode (SBD), was given in Section 5.12. We encourage the reader to review Section 5.12 before proceeding with the examination of this section. The disadvantages are a relatively high power loss per gate (1 to 10 mW); relatively small voltage fluctuations and correspondingly narrow noise margins; low packing density, mostly as a result of the high power loss per gate; and low production yield.

The current situation is that a few specialized manufacturers produce SSI, MSI and some LSI digital circuits that perform relatively specialized functions, with a price per gate that is much higher than that of silicon digital ICs. The lack of standards concerns not only the topology of the base gate, but also the supply voltages used.

Direct-Coupled FET Logic (DCFL)

From the above description, we see that the output voltage swing of the DCFL gate is limited to a value less than 0.7 V (typically about 0.5 V) by gate conduction. Further details on the operation of the DCFL gate are illustrated by the following example. From the above description of DCFL gate operation, we found that VOH = 0.7 V.

The slope dvO ⁄dvI in FIGURE 14.48 The DCFL gate where the input of the next gate is represented by a Schottky diode Q3. The average discharge current is found by calculating i1 and iL at the beginning and end of the discharge interval.

FIGURE 14.49  Transfer characteristic of the DCFL inverter of Fig. 14.48.
FIGURE 14.49 Transfer characteristic of the DCFL inverter of Fig. 14.48.

Logic Gates Using Depletion MESFETs

Transistor QPD also provides the current required to discharge a load capacitance when the output voltage of the gate goes low, hence the name "pull-down" transistor and the subscript PD. The difference between the two currents will flow through the gate terminal of the input transistor of the next gate in the chain, QS2. Since its drain is at +2.1 V, QS will operate in the saturation region and will take away some of the current provided by QL.

The segment AB of the transfer curve represents the high gain operating region, with a slope equal to . The segment BC of the transfer curve corresponds to QS operating in the triode region.

Figure 14.51 shows the basic inverter circuit of a family of GaAs logic circuits known at FET logic (FL)
Figure 14.51 shows the basic inverter circuit of a family of GaAs logic circuits known at FET logic (FL)

Schottky Diode FET Logic (SDFL)

Buffered FET Logic (BFL)

In this way, we will explain the function of each of the steps in the complete TTL gate circuit. However, standard TTL has now been virtually replaced by more advanced forms of TTL that have improved performance.

Evolution of TTL from DTL

Reasons for the Slow Response of DTL

Input Circuit of the TTL Gate

Therefore, Q1 will operate in the inverse active mode, that is, in the active mode, but with the roles of emitter and collector reversed. Thus, the gate input current will be very small, and the base current of Q3 will be approximately equal to I. This current will be sufficient to drive Q3 into saturation, and the output voltage will be low (0.1 to 0.2 V).

The base-emitter junction of Q1 will be biased and the base voltage of Q1 will therefore drop to 0.9 V. Eventually, the collector current of Q1 will become negligibly small, meaning its VCEsat will be approx. 0.1 V and the base of Q3 will be at about 0.3 V, keeping Q3 in cutoff.

FIGURE 14.10  Analysis of the conceptual TTL gate when the input is high.
FIGURE 14.10 Analysis of the conceptual TTL gate when the input is high.

Output Circuit of the TTL Gate

14.13, with Q4 placed on top of Q3, the circuit is named totem-pole output stage. Since the pull-up is achieved here by an active element (Q4), the circuit is said to have an active pull-up. Transistor Q3 turns on and transistor Q4 turns off, and the circuit is simplified to that shown in Fig.

The collector current of Q3 will be βIB, which is 21.5 mA, and the circuit will have the equivalent shown in the figure. Assume that this happens instantaneously, and so at t = T+ the circuit simplifies to that of the figure.

FIGURE 14.13  The totem-pole output stage.
FIGURE 14.13 The totem-pole output stage.

The Complete Circuit of the TTL Gate

The transistor model that applies in this range is more complex; since the interval in question is quite short, we shall not pursue the matter further. We have already analyzed this circuit in steady state and thus know that vO will eventually reach +3.79 V. Defining the rise time tr as the time for vO to reach 90% of the final value, we get , resulting in tr = 6.4 ns.

The totem pole circuit in the TTL gate has two additional components: a 130 Ω resistor in the collector circuit of Q4 and a diode D in the emitter circuit of Q4. We will now give a detailed analysis of the TTL gate circuit in its two extreme states: one with a high input and one with a low input.

Analysis When the Input Is High

Because the driver stage Q2 supplies two complementary (that is, out of phase) signals, it is known as a phase divider. The saturated transistor Q3 then establishes the low gate output voltage (VCEsat) and provides a low impedance to ground. In the low-output state, the gate can sink a load current iL, provided the value of iL does not exceed β× 2.6 mA, which is the maximum collector current that Q3 can sustain while remaining in saturation.

To maintain the logic-0 level below a certain specified limit, a corresponding limit must be placed on the load current iL. As will be seen shortly, it is this limit that determines the maximum TTL gate inhibition.

Analysis When the Input Is Low

Since the output current that a TTL gate can sink is limited to a certain maximum value, the maximum fan-out of the gate is directly determined by the value of IIL. Depending on the value of iL, Q4 will either be in the active mode or in the saturation mode. With the gate output terminal open, the current iL will be very small (mostly leakage) and the two junctions (base-emitter junction of Q4 and diode D) will hardly conduct.

Assuming that each junction has a 0.65-V drop and neglecting the voltage drop across the 1.6-kΩ resistor, we find that the output voltage will be

EXERCISES

As iL increases, Q4 and D conduct more strongly, but for a region of iL, Q4 remains in the active state and vO is given by. Then the output voltage is determined by the 130-Ω resistor according to the approximate relationship (14.5).

Function of the 130- Ω Resistance

CHARACTERISTICS OF STANDARD TTL

Because of its historical popularity and continuing importance, TTL will be studied further in this and the next sections. In this section we will consider some of the important properties of standard TTL gates.

Transfer Characteristic

Neglecting the load of the emitter follower Q4 on the collector of Q2, we can obtain the gain of the phase divider from This current will vary from zero (when Q2 starts to turn on) to a value that causes a voltage of about 0.6V at the emitter of Q2. Since the output follower gain of Q4 is close to unity, the total gate gain, which is the slope of segment BC, is approximately −1.45.

To see how this comes about, notice that from point B more and more of the base current of Q1 is diverted to its base-collector junction. Thus, while the drop across the base-collector junction increases, that across the base-emitter junction decreases.

Manufacturers’ Specifications

Propagation Delay

Dynamic Power Dissipation

The TTL NAND Gate

Although an unused input terminal can theoretically be left open, this is generally not a good practice. An open circuit input terminal acts as an "antenna" that "picks up" interfering signals and thus can cause faulty gate switching. An unused input terminal must therefore be connected to the positive power supply through a resistor (for example 1 kΩ).

In this way, the corresponding base-emitter junction of Q1 will be reverse biased and thus have no effect on the operation of the gate. The series resistor is included to limit the current in the event of a failure of the base-emitter junction due to transients on the power supply.

Other TTL Logic Circuits

The standard TTL circuits studied in the two previous sections were introduced in the mid-1960s. Although Q2 discharges quite quickly due to the active mode of operation of Q1, as already explained, this is not true for Q3, whose base charge must leak through the 1-kΩ resistor in its base circuit. Second, the resistances in the circuit, together with the various transistor and wiring capacitances, form relatively long time constants, which contribute to the lengthening of the gate delay.

The first is to prevent transistor saturation and the second is to reduce the values ​​of all resistors.

Schottky TTL

Gambar

Fig. 5.69(a) shows a simplified structure of the  n -channel JFET. It consists of a slab of  n -type silicon with  p -type regions diffused on its two sides
FIGURE 5.70   Physical operation of the  n -channel JFET:  (a)  For small  v DS the channel is uniform and the device functions as a resistance whose value is controlled by  v GS
FIGURE 5.71  Cross-section of a GaAs Schottky-barrier diode (SBD) and a MESFET.
TABLE 5.2 Typical Parameter Values for GaAs MESFETS and Schottky Diodes in L = 1 µm  Technology, Normalized for W = 1 µm
+7

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