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International Journal on Mechanical Engineering and Robotics (IJMER)

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ISSN (Print) : 2321-5747, Volume-3, Issue-4,2015 31

A Literature Review on Design and Performance analysis of Graphite metal as Heat sink for Microprocessor in CPU

1Yogesh G. Joshi, ²Dhananjay R. Ikhar

1,2Department of Mechanical Engineering D.M.I.E.T&R Sawangi (Meghe), Wardha Email: ¹[email protected], ²[email protected]

Abstract - The increase in dissipated power per unit area of electronic components sets higher demands on the performance of the heat sink. Also if we continue at our current rate of miniaturization, laptops and other electronic devices can get heated up tremendously. Hence we require a better heat dissipating heat sink system to overcome the excess heat generating problem. To handle the excessive and often unpredictable heating up of high performance electronic components like microprocessors, we need to predict the profile based on temperature of the heat sink used. Bearing in mind the A performance analysis has presented on heat sinks of the same model in this project , namely a graphite metal heat sink and aluminum heat sink. In the same conditions, the temperature distribution, pressure and velocity fields of the aluminum heat sink were analyzed. Besides, the temperature distribution and thermal resistance of these heat sinks were compared and analyzed with the graphite metal heat sink.

The graphite-metal heat sink has great advantages in CPU heat dissipation for the excellent thermal conductivity.

Hence after performance analysis it will ascertain the advantage of graphite metal heat sink over aluminum heat sink. And hence will define and fabricate a graphite metal heat sink which can replace the aluminum heat sink.

I. INTRODUCTION

TODAY’S rapid IT development like internet PC is capable of processing more data at a tremendous speed.

This leads to higher heat density and increased heat dissipation, making CPU temperature rise and causing the shortened life, malfunction and failure of CPU. The failure rate of electronic components grows as an exponential function with their rising temperature. Power dissipation would be a major bottleneck to development of the micro electronic industry in the next 5 to 10 years.

The performance level of electronic systems such as computers are increasing rapidly, while keeping the temperatures of heat sources under control has been a Challenge.

Many cooling techniques such as cooling by the heat pipes, cold water, and semiconductor and even by liquid nitrogen were proposed and adopted. Liquid nitrogen

cooling is very expensive and not suitable for conventional use. However many industries have had to begin looking to high capacity cooling technologies rather than air cooling. Liquid cooling has been used for many years by such companies as Cray, IBM and Honeywell. Technologies receiving a lot of interest include liquid cooling using micro channel heat exchangers, heat pipes (in laptops and many non- electronics applications) and thermo – electric devices.

Heat pipes are a sophisticated alternative, but cost, space and reliability constraints typically place heat pipes out of the running. Heat pipes are effective when the transport scale is large compared to package (computer) dimensions. For high volume manufacture, the heat sinks should be inexpensive, reliable and fit to other constraints in the manufacturing process. The modified fin geometry with air cooling is more effective and economic, since the water cooling requires water pump, a separate cooling system for coolant and a separate flow circuit. The air cooling technique is always significant and worthy of further study.

At present, the common methods of the CPU temperature control are divided into two aspects: 1) to decrease the computer working environment temperature. 2) To design a good heat dissipation for the CPU, which focuses on new technology, new structures and new materials at home and abroad. So this project deals with the designing of the graphite metal based heat sink to overcome the problem of heating in the CPU.

1.1Heat Sink:

“Heat sink is a passive heat exchanger that cools the device by dissipating heat into the surrounding medium.”

1.2 Heat Sink Using In CPU:

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The use of the heat sink commonly befalls on two places, At first on the processor of the CPU and an additional one is on the Graphic Hardware of CPU.

Processor of CPU Graphic Hardware in CPU

II. LITERATURE REVIEW

A literature review has been done on the most recent developments in the areas of heat sink. Most of the research carried out in heat sink for CPU describes the specific design of the component for the cooling purpose. It has been found that no graphite metal heat sink has been actually fabricated which can be applicable for the CPU.

You-peng Liu, Zhi-ping Xu, Qian Zhu,, was conceded out “The Simulation and Optimization of the CPU Heat Sink for a New Type of Graphite “ published in JOURNAL OF ENVIRONMENTAL ENGINEERING AND TECHNOLOGY VOL. 1, NO. 3, MAY 2012.

Comparison of Aluminum, copper and graphite has been analyzed as pin heat sink.

Dr. P. Govindarajan, R.Mohan has conducted “Thermal analysis of CPU with composite pin fin heat sinks

“published in International Journal of Engineering Science and TechnologyVol. 2(9), 2010, 4051-4062 . The paper deals with analysis of pin type fin for better performance.

V. Nookala, D. Lilja, and S. Sapatnekar. Temperature- aware floorplanning of microarchitecture blocks with ipc-power dependence modeling and transient analysis.

In Proceedings of the 2006 International Symposium on Low Power Electronics and Design (ISLPED), pages 298–303, Oct 2006. The paper shows the transient analysis of micoarchitecture block.

ÖZTÜRK, Emre , studied on CFD analyses of heat sinks for CPU cooling with fluent , The graduate school of natural and applied sciences of middle east technical university , In this study, forced cooling of heat sinks mounted on CPU’s was investigated. Heat sink effectiveness, effect of turbulence models, effect of radiation heat transfer and different heat sink geometries were numerically analyzed by commercially available computational fluid dynamics software.

Zhipeng Zeng, Yanshu Zhang, Yi Zhou [3] done an experimental study on superplastic forming of a front fender of 5182 aluminum alloy. Also made designing and manufacturing of front fender, dies, heater and temperature controller.

David Copeland , Optimized Heat Sink for Forced Convection , has provide thesis on the optimized heat sink for the better heat transfer in a system .

III. AIM AND OBJECTIVE

Aim:

The primary focus of this research to design the best heat sink with dimensions and also with suitable material to balance the cost as compare to aluminum heat sinks. The major research objectives are:

1. Replacing the material used for Heat Sink for better performance by Introducing Graphite Metal.

2. Determining specific Loop Holes in the in the existing aluminum heat sink.

3. Specific comparative parameter for Aluminum and Graphite Metal as a heat sink Material.

Objectives:

• To reduce temperature of heat sink by maximizing heat dissipation rate.

• To produce a material for heat sink same cost as that existing heat sink.

• Good performance with etiquette design.

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Applied Thermal Engineering, pp 1137-1144.

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