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Title: Investigation on the morphology of sintered silver nanomaterial for electronic packaging application
Author(s): Durairaj, R (Durairaj, R.); Das, M (Das, M.); Morris, E (Morris, E.); Namasivayam, S (Namasivayam, S.) Edited by: Mamat MH; Khusaimi Z; Bakar SA; Nor AM; Soga T; Mahmood MR
Source: NANOSCIENCE, NANOTECHNOLOGY AND NANOENGINEERING Book Series: Advanced Materials Research Volume: 832 Pages: 21-+ DOI:
10.4028/www.scientific.net/AMR.832.21 Published: 2014 Times Cited in Web of Science Core Collection: 0 Total Times Cited: 0
Usage Count (Last 180 days): 0 Usage Count (Since 2013): 6 Cited Reference Count: 12
Abstract: Silver nanoparticles are seen as a possible replacement for high temperature solders containing 90-95 wt% Pb, which is widely used in various applications e.g.
automotives. These high temperature solders have been exempted from the Restriction of Hazardous Substances (RoHS) Directive due to very limited drop-in replacement for the high temperature solders. Although the effect of sintering temperature of silver nanoparticles has been studied, the mechanism involved in the changes in the morphology of the particles and interfacial reaction with the substrate as a function of sintering temperature must be understood. In this study the effect of sintering temperature on the morpohology of Ag nanoparticles is discussed. The Scanning Electron Microscopy (SEM) analysis was used to analyze the changes in morphology of silver particles agglomerates with sintering temperatures. Results showed necking of the nano-silver powder, which indicated the occurrence of sintering through grain boundary diffusion process. Meanwhile, the micro-silver powder showed agglomeration of particles but no necking was observed. The study has shown that the Ag agglomerates was observed to undergo various changes to the particle morphology with different sintering temperatures.
Accession Number: WOS:000337644900004 Language: English
Document Type: Proceedings Paper
Conference Title: International Conference on Nanoscience and Nanotechnology (NANO-SciTech 2013) Conference Date: MAR 01-04, 2013
Conference Location: Shah Alam, MALAYSIA
Conference Sponsors: NANO-SciTech Ctr, Inst Sci, Univ Teknologi MARA, Nagoya Inst Technol, Dept Environm Technol, Minist Sci Technol & Innovat, Naoya Inst Technol, Univ Teknologi MARA, Off Ind Community & Alumni Network, Univ Teknologi MARA, Res Management Inst, Univ Teknologi MARA, Inst Sci, Univ Teknologi MARA, Fac Appl Sci, Univ Teknologi MARA, Fac Elect Engn, Univ Teknologi MARA, Inst Leadership & Qual Management, Univ Teknologi MARA, Corporate Commun Dept, DKSH Holdings, Quasi-S Sdn Bhd, Crest Nanosolut M Sdn Bhd, Sukimi Lube M sdn Bhd, JEOL Sdn Bhd, Taat Bestari Sdn Bhd, Exprojaya Sdn Bhd, Alpha Instruments Supplies & Serv Sdn Bhd, nanoLab Instruments Sdn Bhd
Author Keywords: Silver nanoparticles; Sintering; Lead-free solder paste; Diffusion; Morphology KeyWords Plus: NANOPARTICLES; CARBOXYLATE; AMINE; SIZE
Addresses: [Durairaj, R.; Das, M.; Morris, E.] UTAR, FES, Dept Engn, Kuala Lumpur 53300, Malaysia.
[Namasivayam, S.] Taylors Univ, Sch Engn, Satesh Namasivayam, Subang Jaya 47500, Malaysia.
Reprint Address: Durairaj, R (reprint author), UTAR, FES, Dept Engn, Kuala Lumpur 53300, Malaysia.
E-mail Addresses: [email protected]; [email protected]; [email protected] Author Identifiers:
Author ResearcherID Number ORCID Number
Namasivayam, Satesh A-1162-2017
Ezra, Morris 0000-0003-4218-2263
Publisher: TRANS TECH PUBLICATIONS LTD
Publisher Address: KREUZSTRASSE 10, 8635 DURNTEN-ZURICH, SWITZERLAND Web of Science Categories: Nanoscience & Nanotechnology; Materials Science, Multidisciplinary Research Areas: Science & Technology - Other Topics; Materials Science
IDS Number: BA7ND ISSN: 1022-6680 ISBN: 978-3-03785-913-1
29-char Source Abbrev.: ADV MATER RES-SWITZ Source Item Page Count: 2
Output Date: 2018-01-02
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