Index of /intel-research/silicon

(1)

Copyright 2003 Intel Corporation

Green Design

at Intel

Building in Ecology

Terrence J. McManus P.E., DEE

Intel Fellow, Director EHS Technologies

Intel Corporation

(2)

Copyright 2003 Intel Corporation

Agenda

¾

Brief Overview of Intel

¾

Product Ecology and

Design for the Environment (DFE)

¾

Green Design Examples at Intel:

Lead-free Semiconductors & Electronics

Environmental Performance & Employee Safety

Energy Conservation in PCs

(3)

Copyright 2003 Intel Corporation

Brief Overview of Intel

(4)

Copyright 2003 Intel Corporation

Intel Founded

First DRAM

Intel286™

Processor ProcessorIntel486™

Intel Pentium® Processor

First EPROM DRAMExit

Flash Memory Intro Intel Inside® Launch ProShare® Introduced 100 Mbit E-Net Card

First Intel Inside® Brand TV Ad

19 6 8 1 9 7 0 1 9 71 1 97 8 1 9 82 1 98 5 1 98 6 1 98 9 19 9 1 1 9 92 1 9 93 19 9 5 19 9 4 1 99 7 First Microprocessor 4004 First Intel Motherboard 19 9 8 Intel Celeron™ Processor 1 9 99 1 Gbit E-Net Card Intel Pentium® III And Xeon™ Processors Internet Exchange Architecture 2 0 00 2 0 01 Pentium® 4 Processor 2 0 02

1st _Pb-Free Devices 2 0 03 Centrino®

Intel

(5)

Copyright 2003 Intel Corporation

Intel’s High Volume Manufacturing Sites

80,000 Employees Ireland Ireland Fab 14/24 Fab 14/24 Israel Israel Fab 8/18 Fab 8/18 Oregon Oregon Dev D1C/D1D Dev D1C/D1D Fab 15/20 Fab 15/20 California California Dev D2 Dev D2 Colorado Colorado Fab 23 Fab 23 Arizona Arizona Fab12/22 Fab12/22 New Mexico New Mexico Fab 7/11/11X Fab 7/11/11X Mass. Mass. Fab 17 Fab 17 Costa Rica Costa Rica

San Jose A/T

A/T Dev

A/T Dev MalaysiaMalaysia

Penang A/T Penang A/T Kulim A/T Kulim A/T China China Pudong A/T Pudong A/T Philippines Philippines Manila A/T Manila A/T Cavite A/T Cavite A/T Washington Washington Systems Mfg. Systems Mfg. Board Mfg. Board Mfg.

Kulim Board/Module Mfg.

Wafer Fab

Systems

(6)

Copyright 2003 Intel Corporation

Intel

’

s EHS Guiding Principles:

¾

Prevent all injuries in the workplace

¾

Be an EHS leader in our communities

and our industry

¾

Reduce the environmental footprint of

(7)

Copyright 2003 Intel Corporation

Product Ecology

and

Design for Environment

Product Ecology

and

(8)

Copyright 2003 Intel Corporation

108 107 106 105 104 103 102 101 100 109 1010

’60 ’65 ’70 ’75 ’80 ’85 ’90 ’95 ’00 ’05 ’10

Transistors Per Die

1011

1K

4K

4K 16K16K

64K 64K 256K 256K 256K 1M 1M 1M 16M 16M 4M 4M 64M 64M 64M 4004 4004 8080 8080 8080 8086 8086 80286 80286 i386™ i386™ i486™ i486™ i486™ Pentium Pentium®®

Memory Memory Microprocessor Microprocessor Pentium Pentium

Pentium®®

II

Pentium

Pentium®® _III_III 256M 256M 512M 512M 512M Pentium

Pentium®® ₄

Itanium

Itanium®® 1G

1G 2G2G

4G

128M

Integrated Circuit Complexity

IC Performance to Moore’s Law

(9)

Intel

’

s Process Technology

Source_{: Intel}

In 26 years, the number of transistors on a chip has increased more than 18,000 times, from 2,300 on the 4004 in 1971 to 42 million on the Pentium® 4 processor.

0.8µ 0.6µ 0.35µ 0.25µ 0.18µ 0.13µ # Transistors

Basic Feature Size in microns

In Millions

Pentium®

Processor

Pentium® _Pro

Processor

Pentium® _II

Processor

Pentium® _III

Processor

Pentium® ₄

Processor

3.3

5.5

7.5

9.5-25

42+

480

Itanium® 2

(10)

130nm Technology

¾ Intel Technology – To produce leading edge

microprocessors (1.0-3.0+ GHz) for desktop, mobile and server applications

25 wafers in each lot (200mm)

60 to 300+ microprocessors per wafer. It takes an average of 440 operation steps to make a

microprocessor & 55 days on avg.

42 to 480 Million transistors per microprocessor

(11)

EHS Technology Engagement Model

YEARS to High Volume Manufacturing

Ability to Effect Change

6 4 2 0

Manufacturing Ramp Supplier R&D

External Research Process Development

Commercialization Phases Demonstration Ramp to HVM

Very early engagement through universities and government labs Early engage-ment through tool supplier targets Optimum Time to effect change

in technology Technology

frozen, major changes require much

more effort -use continuous improvement

Research

(12)

Microprocessor Ramp Trends

1993

1993 19941994 19951995 19961996 19971997 19981998 19991999 20002000 20012001 20022002 20032003 20042004 20052005

Wafer Starts / Week

Wafer Starts / Week

(200mm Equiv.)(200mm Equiv.)

0.6 µm

0.35 µm

0.25 µm

0.18 µm

0.13 µm

Forecast

Microprocessor Ramp Trends

(13)

Copyright 2003 Intel Corporation

Rapid Technology Changes

Provides Opportunities and Challenges

¾ Intel develops and delivers a new chip manufacturing process every 2 years:

Each new process is 30 months for Technology Development

¾ Primary opportunity for EHS improvements is in TD

¾ Intel has an integrated Design for EHS Program

¾ EHS is involved throughout the TD process for: Manufacturing Process development

Chemical selection and Waste Management

Facility design

Ergonomics and Equipment Safety

Manufacturing equipment selection

(14)

Copyright 2003 Intel Corporation

Chemical Use & Recycle Approach

INTEL INTEL

PRODUCT

CHEMICAL

MANUFACTURER

CHEMICAL CHEMICAL

RETURN CHEMICAL

CHEMICAL

MANUFACTURER

“CONSUMABLE” (No emissions/waste)

“RENT-A-CHEM”

(15)

Copyright 2003 Intel Corporation

Estimated 300mm emissions & water use

Relative to 200mm

300mm is more Environmentally Friendly

100

55%

42%

48% 40%

80

Volatile Organic Compounds

20 40 60

% Reduction

Perfluorocarbons

Hazardous Air Pollutants

Ultra-pure water

Vendor supplied data

Source_{: Intel}

(16)

100%

FRESH WATER

Water Model

–

with Conservation

UPW

LAWN/GROUNDS IRRIGATION

FAB

COOLING TOWERS

Air Emissions TREATMENT

AWN

98 % •Xeric Landscaping

Reduce

76 %

Reduce

Recovery System

•UPW System Reduction 60 %

•Manufacturing Reduction

Reduce

47 % _{•Process Water Reuse}

Reduce

Reclaim

(17)

Product Ecology

–

Definition & Focus

¾

Product Ecology

– Designing environmentally

compatible products and manufacturing processes

while maintaining product price/performance and

quality characteristics.

¾

Key Focus Areas for “

Green Products

” are:

Material Composition

Manufacturing Design for Environment (DfE)

Design for Disassembly (DfD)

Energy Usage (Products & Manufacturing)

End-of-Life Management

(18)

Copyright 2003 Intel Corporation

Green Product

Drivers

¾

The Market Place

– Japan OEMs are setting

“

Green Specifications

” with Sony one of the

leaders and their “

Green Supplier

” Audits.

¾

Regulations

– The EU is driving thru the

RoHS and WEEE Directives. Japan has

recycle requirements for white goods

including PCs and other electronics.

(19)

Copyright 2003 Intel Corporation

Green Design Examples at Intel:

- Lead-free Semiconductors & Electronics

-- LeadLead--free Semiconductors & Electronics free Semiconductors & Electronics

- Environmental Performance & Employee Safety

-- Environmental Performance & Employee Safety Environmental Performance & Employee Safety

- Energy Conservation in PCs

-- Energy Conservation in PCsEnergy Conservation in PCs

- Scrap Wafers to Solar Energy

(20)

Copyright 2003 Intel Corporation

Lead in PCs

–

Where is it ?

Monitor

~900 g

(2 lbs)

Printed Circuit Board

5

-

10 g

Microprocessor

~0.2 g

Peripherals

2

-

3 g

For comparison:

House key ~0.1House key ~0.1--0.3 g0.3 g

(21)

Copyright 2003 Intel Corporation

FCPGA CPU Package

Other Packages Containing Lead - Wire bond BGA: Balls

- Surface Mount Leaded Pkgs: Leads

C4 Bumps

LEGEND

No Lead

Description

Lead

Definition

Where’s the Lead in PCBs ?

PC Motherboard

Leads/Pins

Caps

mPGA socket

Passives

Balls C4 Bumps Balls

(Exempt)

(22)

Lead

-

free BGA packages

Package Silicon Die

Tin-Silver-Copper solder ball

New Lead-Free Process

Gold wire bond Gold

wire bond

Lead-Tin solder ball

Today’s Lead-Tin Process

(23)

Pb

-

free Challenges

¾ Solder Paste and Solder Spheres

SnAgCu (95.5% / 4% / 0.5%)

¾ Wave Solder

SnCu (99.3% / 0.7%)

¾ Board Surface Finish

ImAg* and OSP*

¾ Flip Chip Bumps – FCxGA

Legacy processes: Due to exemption, no plans to convert

Future processes: Under investigation. No conversion schedule at this time

¾ Lead Frame Packages

Matte-Sn finish

Still need to address Tin Wisckers

Solder Spheres

Board Surface Finish Solder Paste

Printed Wiring Board

Component

C4 Bumps

Chip

*ImAg – Immersion Silver

(24)

Intel’s Product Conversion Status

¾ Intel has been developing Pb-free products for over 3 yrs

¾ New materials sets have been selected and certified to support the transition

¾ Intel is shipping Pb-free product

¾ SCSP, vfBGA, and EasyBGA are Pb-free certified

¾ Pb-free products are ‘build to order’ (at this phase of the transition). Six months notice required.

¾ RoHS exemptions & definitions need further clarification

¾ Many new Intel products are ‘Pb-free ready’ allowing rapid conversion to Pb-free leads/balls

(25)

Approaches in Japan, US and China

¾

Japan

No ban on the use of lead in electronics and encouragement of Green Products

Selected electronics recycle law (PC, TV and appliances)

Postal Service provides transportation for recycling

Energy Star Program

¾

United States

No ban on the use of lead in electronics and encouragement of Green Products

Have banned lead in gasoline, paints and plumbing

Voluntary e-recycling (HP, Dell, IBM, etc.)

EPA funding Pilot e-recycling Program

Energy Star Program delivers big energy savings

Life Cycle Assessment on tin-lead & lead-free solders

¾

China

(26)

WEEE Directive & Intel’s Focus Areas

¾ Mark plastics for easy identification (ISO 11469)

¾ Design for disassembly (fewer parts, fasteners, adhesives, etc)

¾ Use single polymer or compatible polymer type, where possible.

¾ Use recycled plastics in structural plastics and case parts.

¾ Use packaging with recycled content and return shipment packaging from our Customers (OEMs)

(27)

RoHS Directive’s Flame Retardants

¾ PBDE and PBB are banned under RoHS Intel products are free from PBDE and PBB

Many OEMs have restricted used of PBB and PBDE

¾ TBBPA (tetrabromobisphenol-A) is the flame retardant widely used in electronic products for fire safety

TBBPA is commonly used in components and Printed Circuit Boards

No bans currently exist for TBBPA, although it is under evaluation

(28)

Environmental Performance &

Employee Safety

Environmental Performance &

(29)

Environmental Performance 2002

¾ >55% of Chemical Waste recycled worldwide

¾ >65% of Solid Waste recycled worldwide

¾ Fresh water usage 16 million gallons/day worldwide

¾ 30% reduction in VOC emissions since ’99 (218 tons worldwide in 2002)

¾ Global warming emissions 1.03 MMTCE (includes electricity usage)

¾ ISO 14001 Certified

¾ 30,000 PCs refurbished and delivered to schools and non-profit organizations

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Intel’s is ISO 14001 Certified

¾ Approach – Corporate Wide Registration

¾ Scope – All semiconductor manufacturing

operations and sites

¾ Registration Process – Based on registrar

audits of the Corporate EMS and 5 site audits (Shanghai, AZ, Costa Rica, CA, & Malaysia)

¾ Sustaining Audits – Remaining sites

audited over next three years (9 countries and states)

¾ Certification Issued – 30 July 2002

¾ Registrar – National Standards Authority

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World

-

class Safety Performance

Recordable Rate per 100 Employees

0.26 1.2

0.74

0.45

0.28

0.20

0 0.5

1 1.5 2 2.5

1996 1997 1998 1999 2000

U.S. Semiconductor Industry 2001 Rate

World-class Rate = 0.35

2001 2002

0.30

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Green Cross Award for Safety

¾ Craig Barrett accepts on behalf of Intel, the National Safety Council’s Green Cross for Safety Award,

June 2001

¾ Intel’s injury rates are 37X

(33)

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Product Energy Landscape

¾

Global Warming is a reality

¾

Kyoto Protocol – Sets international focus

¾

Proliferation of Energy Star in US, EU, Japan

¾

New product requirements:

Smaller Form Factors and Light Weight

Wireless Connectivity

Always Connected Computing/Ease of Use

(35)

Instantly Available PC

(IAPC)

Intel’s IAPC technology enable PC Manufacturers to:

¾ Deliver PCs that consume < 5 watts in “Sleep mode”

¾ Provide Quick “wake-up” ~5 seconds

¾ Improve Global energy savings vs. Energy Star

Energy Star standard is <15 watts in “Sleep Mode”

¾ Advance PCs capabilities + reduce global warming and electricity generation – ideal for the home office

US EPA estimates energy savings by 2010 vs. Energy Star: ¾ Equivalent to removing 60 million cars from the roads for one year

¾ 7.5 Million Metric Tons per year of CO2 eliminated in US

¾ Intel’s worldwide global warming emissions = ~1 MMTCE

(36)

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Recycling Scrap Wafers

¾ Semiconductor fabrication

generates reject and test scrap wafers

¾ Silicon is an excellent material to convert light (photons) to

electricity (electrons)

¾ Since 1999, 3 Million Intel scrap wafers have been converted to 2.4 Million solar cells

(38)

Summary

¾

Product Ecology/DfE are the right things to do

¾

Intel invested a significant EHS effort in 300mm

¾

Intel has successfully developed Pb-free

package and process technology

Management of a flawless transition to Pb-free products is a major challenge for the industry

RoHS exemptions and definitions need clarification

¾

Continue to develop new recycle opportunities

(39)

Questions?